Kiʻekiʻe kiʻekiʻe mana lako Module T1

ʻO ka wehewehe pōkole:

Pūʻolo Huahana: T1

Introduction: ʻO ke ʻano hoʻopili kiʻekiʻe kiʻekiʻe o kēia manawa, me ka hoʻohana ʻana i ka resin epoxy kiʻekiʻe-maʻemaʻe kiʻekiʻe no ka hoʻopili ʻana, e hoʻomaikaʻi ana i ka ikaika mechanical a me ka pale ʻana i ka wai, hoʻonui i ka lōʻihi a me ka hilinaʻi kiʻekiʻe. Hoʻohana nui ʻia ia i ka hoʻololi ʻana i ka mana, ka mea hoʻololi, ka pale anti reverse connection protection a me nā noi ʻē aʻe.

E hoʻouna i ka leka uila iā mākou

Huahana Huahana

Ka nānā 'ana i ka manawa pane

Laulā ana

Huahana Huahana

Nā pōmaikaʻi o ka YUNYI's Power Supply Module T1:

1. ʻO ke kumukūʻai hoʻokūkū me ke kūlana kiʻekiʻe.

2. ʻO ka hana kiʻekiʻe me ka manawa alakaʻi pōkole.

3. Paʻa a hilinaʻi ma lalo o nā ʻano kūlohelohe like ʻole.

4. ʻO ka liʻiliʻi liʻiliʻi, e kōkua ana i ka hoʻonui ʻana i ka nui o ka papa kaapuni

Nā kaʻina hana o ka hana chip:

1. Paʻi Mechanically（Paʻi wafer ʻakomi pololei loa）

2. ʻAhi ʻakomi mua （Lako Hoʻopaʻa Aunoa ，CPK>1.67）

3. Ho'āʻo Polarity ʻAunoa (Pcise Polarity Test)

4. Hui Pū 'akomi

5. Kūʻai (Hoʻomalu me ka hui ʻana o ka Nitrogen & Hydrogen Vacuum Soldering)

6. 'Automatic Second-etching (Automatic Second-etching with Ultra-pure Water)

7. Hoʻopili 'akomi (Uniform Gluing & Precise Calculation are realized by Automatic Precise Gluing Equipment)

8. Ho'āʻo Thermal Automatic (Koho Aunoa e ka Thermal Tester)

9. Ho'āʻo 'akomi (Multifunctional Tester)

Nā ʻāpana:

Helu Mahele	Pūʻolo	VRWM V	IO A	IFSM A	IR Ma	VF V	Ua ʻōlelo ʻo Trr ns
SM090KD800G1	T1	800	90	2000	0.02	1.05	—
SM090KE800G1	T1	800	90	2000	0.02	1.05	—
SM090KC800G1	T1	800	90	2000	0.02	1.05	—
SM090KJ800G1	T1	800	90	2000	0.02	1.05	—