ʻO D2PAK (TO-263) SiC Diode i hilinaʻi nui ʻia
Nā pōmaikaʻi o ka D2PAK o YUNYI (TO-263) SiC Diode:
1. Haʻahaʻa inductance
2. ʻO ke kumukūʻai hoʻokūkū me ke kūlana kiʻekiʻe.
3. ʻO ka hana kiʻekiʻe me ka manawa alakaʻi pōkole.
4. ʻO ka liʻiliʻi liʻiliʻi, e kōkua ana i ka hoʻonui ʻana i ka nui o ka papa kaapuni
Nā ʻanuʻu o ka hana chip:
1. Paʻi Mechanically(Paʻi wafer ʻakomi pololei loa)
2. ʻAhi ʻakomi mua (Lako Hoʻopaʻa Aunoa ,CPK>1.67)
3. Ho'āʻo Polarity ʻAunoa (Pcise Polarity Test)
4. Hui Pū 'akomi
5. Kūʻai (Hoʻomalu me ka hui ʻana o ka Nitrogen & Hydrogen Vacuum Soldering)
6. 'Automatic Second-etching (Automatic Second-etching with Ultra-pure Water)
7. Hoʻopili 'akomi (Uniform Gluing & Precise Calculation are realized by Automatic Precise Gluing Equipment)
8. Ho'āʻo Thermal Automatic (Koho Aunoa e ka Thermal Tester)
9. Ho'āʻo 'akomi (Multifunctional Tester)
Nā palena o nā huahana:
Helu Mahele | Pūʻolo | VRWM V | IO A | IFZM A | IR μa | VF V |
ZICRB5650 | D2PAK | 650 | 5 | 60 | 60 | 2 |
ZICRB6650 | D2PAK | 650 | 6 | 60 | 50 | 2 |
Z3D06065G | D2PAK | 650 | 6 | 70 | 3(0.03 maʻamau) | 1.7(1.5 maʻamau) |
ZICRB10650CT | D2PAK | 650 | 10 | 60 | 60 | 1.7 |
ZICRB10650 | D2PAK | 650 | 10 | 110 | 100 | 1.7 |
Z3D10065G | D2PAK | 650 | 10 | 115 | 40(0.7 maʻamau) | 1.7(1.45 maʻamau) |
ZICRB20650A | D2PAK | 650 | 20 | 70 | 100 | 1.7 |
ZICRB101200 | D2PAK | 1200 | 10 | 110 | 100 | 1.8 |
ZICRB12600 | D2PAK | 600 | 12 | 50 | 150 | 1.7 |
ZICRB12650 | D2PAK | 650 | 12 | 50 | 150 | 1.7 |
Z3D30065G | D2PAK | 650 | 30 | 255 | 140(4 maʻamau) | 1.7(1.4 maʻamau) |
Z4D05120G | D2PAK | 1200 | 5 | 19 | 200(20 maʻamau) | 1.8(1.65 maʻamau) |
Z4D20120G | D2PAK | 1200 | 20 | 162 | 200(35 maʻamau) | 1.8(1.5 maʻamau) |
Z3D20065G | D2PAK | 650 | 20 | 170 | 50(1.5 maʻamau) | 1.7(1.45 maʻamau) |
Z3D06065L | DFN8×8 | 650.0 | 6.0 | 70.0 | 3(0.03 maʻamau) | 1.7(1.5 maʻamau) |