Paʻa Paʻa a hilinaʻi i ka mauna ʻili PAR® Nā mea hoʻopau uila (TVS) DO-218AB SM5S
Nā Lae Paʻa o DO-218AB SM5S:
1. Hoʻoponopono ʻia ka chip i loko e ka ʻenehana alakaʻi honua o Chemical Etching Method, manuahi mai nā hopena maikaʻi ʻole i hana ʻia e ka ʻoki ʻana i ke kaumaha.
2. Loaʻa i ka DO-218AB ka mana hoʻihoʻi hou, mahalo i ka nui o ka chip ma mua o kāna mau mea hoʻokūkū.
3. Haʻahaʻa leakage au mai ka lihi o ka chip
4. TJ = 175 °C hiki ke kūpono no ka hilinaʻi kiʻekiʻe a me ka pono automotive
5. Haʻahaʻa haʻahaʻa mua hāʻule uila
6. Hoʻokō i ka ISO7637-2 kikoʻī o ka piʻi ʻana (e like me ke kūlana hoʻāʻo)
7. Loaʻa i ka pae MSL 1, no J-STD-020, LF kiʻekiʻe kiʻekiʻe o 245 °C
Nā ʻanuʻu o ka Chip Production
1. Pa'i Mechanically（Super-paʻi wafer ʻakomi pololei）
2. 'Aunoa First-etching（ʻO nā mea hana hili ʻakomi，CPK>1.67）
3. Ho'āʻo Polarity ʻAunoa (Pcise Polarity Test)
4. Hui Kūʻai ʻakomi
5. Soldering (Hoʻomalu me ka hui ʻana o ka Nitrogen & Hydrogen
Hoʻopili ʻana i ka ʻūhā )
6. 'Automatic Second-etching (Automatic Second-etching with Ultra-pure Water)
7. Hoʻopili 'akomi (Uniform Gluing & Precise Calculation are realized by Automatic Precise Gluing Equipment)
8. Ho'āʻo Thermal Automatic (Koho Aunoa e ka Thermal Tester)
9. Ho'āʻo 'akomi (Multifunctional Tester)
